Yeong-Jyh Lin

Photonics and Display Group
Adaptive-focus Lens

Dr. Yeong-Jyh Lin

Research Scientist

Email: yjlin@creol.ucf.edu
Office: Room 289
Phone: (407) 823-4965

University of Central Florida
College of Optics & Photonics: CREOL & FPCE
4000 Central Florida Blvd.
P.O. Box 162700
Orlando, Florida 32816-2700

Educational History
09/2000 - 07/2005	Ph.D. in Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan (R.O.C.) Dissertation title: Pick-up Process Analysis of Die Bonders
09/1998 - 07/2000	M.S. in Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan (R.O.C.) Thesis topic: Board level reliability of chip scale package under cyclic
09/1994 - 07/1998	B.S. in Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan (R.O.C.)

WORK EXPERIENCES

10/2005 - 03/2007 ChipMOS Technologies (Bermuda) LTD.
R&D engineer for advanced assembly technology development

08/2004 - 06/2005 ChipMOS Technologies (Bermuda) LTD.
Technology consultant for IC assembly process and patents

09/2001 - 01/2003 Far East University, Tainan county, Taiwan, R.O.C.
Adjunct lecturer (Part-time teaching)

07/2000 - 05/2004 E-CAD Technologies CO., LTD
Product engineer for mechanical design (Part-time)

HONORS, LEADERSHIP AND SERVICE

05/2007 Master Oral Examiner, Institute of Engineering Management, National Cheng Kung Univ., Taiwan

09/1994 - 01/2000 Traditional Medicine Treatment Association, National Cheng Kung Univ., Taiwan

Director, Academic Conductor, Senior Consultant

09/1994 - 01/1996 Harmonica Club, National Cheng Kung Univ., Taiwan

Leader of the Harmonic Band, Student Teacher

(Lead the Band to win the Excellent Grade in Southern Musical Competition, Taiwan, Mar.1997)

09/1994 – 09/1995 Excellent Student Scholarship at National Cheng Kung Univ., Taiwan (Ranks No.2 in the Class)

BOOKS

1. Yeong-Jyh Lin and Sheng-Jye Hwang, “Pick-up Process Analysis of a Die Bonder,” VDM Verlag Dr. Mueller e.K., April 2008, (ISBN-13: 978-3639000344)

2. Yeong-Jyh Lin, Chao-Yu Huang, and S.J. Huang, “Pro\ENGINEER Wildfile Basic Course,” Posts & Telecom Press, Beijing, China (ISBN: 7115122237) (In Chinese)

3. Yeong-Jyh Lin, Chao-Yu Huang, and S.J. Huang, “Pro/Engineer Wildfire:Basic(I)(II),” Acro Digital Technology Inc., December 2003 & March 2004, Taipei, (ISBN:9867845854 & ISBN: 9867489055) (In Chinese)

JOURNAL PUBLICATIONS

1. H. Ren, S. Xu, Y. J. Lin, and S. T. Wu, “Adaptive-focus lenses," Optics and Photonics News, pp. 42-47, October 2008.

2. Bin-Hao Chen, Ming-Shan Zheng, Yeong-Jyh Lin, Qing-Song Xio, Ting-Wei Huang, and Zhao-Xiang Wei, “Analysis and Design of a Furnace Used in LCD Panel Manufacturing,” Journal of the Mechatronic Industry, No. 292, July 2007. (In Chinese)

3. G.S. Shen and Y.J. Lin, “A Review of LCD Driver Assembly Technologies,” Chip Scale Review, Vol.9, No. 2, pp55-59, March 2005.

4. Yeong-Jyh Lin and Sheng-Jye Hwang, “Static Analysis of the Die Picking Process,” IEEE Transactions on Electronics Packaging Manufacturing, Vol.28, No. 2, pp. 142-149, April 2005.

5. Yeong-Jyh Lin and Sheng-Jye Hwang, “Temperature Prediction of Rolling Tires by Computer Simulation,” Mathematics and Computers in Simulation, Vol. 67, Issue 3, pp.235-249, November 2004.
(Ranked No.10 of Top 25 Hottest Articles in the Journal – Oct. to Dec. 2004, Ranked No. 22 of Top 25 Hottest Articles in the Journal – Apr. to Jun. 2005)

6. Yeong-Jyh Lin and Sheng-Jye Hwang, “Discussion on Transferring IGES Formatted File into CAE Software ANSYS and Repairing Skill,” CADesinger, No. 174, September 2002. (In Chinese)

CONFERENCE PROCEEDINGS

1. Shu-Ching Ho, Hsiang-Ming Huang, Yi-Chang Lee, Yeong-Jyh Lin, and An-Hong Liu, “The study of laser repair through BCB passivation in flip chip technologies,” SMTA International 2007, Gaylord Palms Resort and Convention Center, Orlando, Florida, October 7 - 11, 2007.

1. Yi-Chang Lee, An-Hong Liu, Emerson Chiu, Vincent Tu, Yeong-Jyh Lin, Hsiang-Ming Huang, Shu-Ching Ho, Jui-Chieh Chiu, Chih-Ming Lin, and Yeong-Her Wang, “Electrical Characterization of TSOP II and FBGA Packages for High-Speed Applications,” SMTA International 2007, Gaylord Palms Resort and Convention Center, Orlando, Florida, October 7 - 11, 2007.

2. G.S. Shen, Y.J. Lee, Yeong-Jyh Lin, Jian-Yu Chen, and Sheng-Jye Hwang, “Structure Deformation of Leadframe in Plastic Encapsulation,” International Microsystem, Packaging, Assembly and Circuits Technology (IMPACT) conference 2007, Taipei International Convention Center, Taipei, Taiwan, October 1-3, 2007.

3. J.Y. Chen, S.Y. Teng, S.J. Hwang, H.H. Lee, D.Y. Huang, Y.J. Lin, Stoke Chen, and G.S. Shen, “Prediction of Flow Induced Lead Deflection of Leadframe Assemblies in Plastic Encapsulation during Molding,” 8th International Conference on Electronic Package Technology, Sofitel Jin Jaing Oriental Hotel, Shanghai, China, August 14-17, 2007.

4. Huei-Huang Lee, Sheng-Jye Hwang, Durn-Yuan Huang, and Yeong-Jyh Lin, “Mold Adhesion Force Measurement,” InterPACK '07, Westin Bayshore Resort and Marina, Vancouver, BC, Canada, July 8-12, 2007.

5. Stoke Chen, G.S. Shen, J.Y. Chen, S.Y. Teng, S.J. Hwang, Y.J. Lin, H.H. Lee, and D.Y. Huang, “The Development of Paddle Shift Analysis for IC Packaging Processing,” 2007 International Symposium on High Design Packaging and Microsystem Integration, Everbrite Convension and Exhibition Center, pp.76-80, Shanghai, China, June 2007, (Http://www.hdpchina.com).

6. Yeong-Jyh Lin and Sheng-Jye Hwang, “Taguchi Analysis of Die Crack Simulation of III-V IC Pick Up Process,” Semicon Taiwan 2003, Taipei World Trade Center, Taipei September 2003.

7. Y.J. Lin, H.H. Lee, S.J. Hwang, and D.Y. Huang, “A Method to Evaluate Temperature Distribution on A Pneumatic Tire Due to Hysteresis Effect,” The 8th Taiwan ANSYS User Conference, Kenting, Pingtung, November 2002. (In Chinese)

8. D.Y. Hwang, S.J. Hwang, H.H. Lee, and Y.J. Lin, “Two Stage Injection Molding of TPE Material,” The 6th Mold Annual Conference, Taipei International Convention Center, Taipei, July 21 2001. (In Chinese)

9. Yeong-Jyh Lin, Huei-Huang Lee, Sheng-Jye Hwang, and Durn-Yuan Hwang, “Solder Ball Reliability of a CSP Under TCT Loading,” 6th Taiwan ANSYS User Conference, Grand Formosa Taroko Hotel, Hualien, November 2000.

10. Yeong-Jyh Lin, Sheng-Jye Hwang, Huei-Huang Lee, and Durn-Yuan Huang, “Board Level Reliability of Chip Scale Package Under Cyclic Thermomechanical Loading,” ChipMOS Technical Symposium 2000, Lakeshore Hotel, Hsinchu, October 2000.

11. G.S. Shen and Y.J. Lin, “Thermal Stress and Lead Deformation Analysis of μBGA,” ChipMOS Technical Symposium, October 1999.

12. S.J. Hwang and Y.J. Lin, “Development of an Interface from CT Scan Data to CAD or RP system,” 11th National Conference on Automation Technology, Chinese Institute of Automation Engineers, July 199. (In Chinese)

ISSUED and PENDING PATENTS

1. Chen Yu-Ren and Lin Yeong-Jyh, “Zigzag-stacked package structure,” US 20080174000

2. Huang Hsiang-Ming, Liu An-Hong, Ho Shu-Ching, Lee Yi-Chang and Lin Yeong-Jyh, “Fabrication process of a MEMS alloy probe,” US 20080124828

3. Huang Hsiang-Ming, Liu An-Hong, Lin Yeong-Jyh, and Lee Yi-Chang, “COB type IC Package to enhance bondibility of bumps embedded in substrate and method for fabricating the same,” US 2070262439; TW Patent 200743198

4. Huang Hsiang-Ming, Liu An-Hong, Lin Yeong-Jyh, Lee Yi-Chang, Tu Wu-Chang, Lin Chun-Hung, and Chiu Shih Feng, “High frequency IC package and method for fabricating the same,” US Patent 20070235871; TW Patent 200731486

5. Huang Hsiang-Ming, Liu An-Hong, Lee Yi-Chang, Lu Liang-Tien, and Lin Yeong-Jyh, “Chip-on-Glass Package of Image Sensor,” TW Patent No. I273686

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